Director of Engineering - Semiconductor / Advanced IC Packaging Location : Austin, TX Salary : 185k - 225k per year Direct Hire - FTE (Onsite) SUMMARY: The primary goal of this position is to promote and drive market adoption, ecosystem leadership, and revenue growth of specific strategic technologies and advanced packaging platforms, including chiplet and package architectures, 2.5D/3D integration, heterogeneous integration, and system-in-package solutions, to global customers through engageme…
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